高锦春，教授，博士生导师，工学博士。主要从事电接触可靠性、无线通信关键技术等研究工作。主持完成国家自然科学基金、省部级项目、国际合作，以及企业合作项目等，参与国家重点研发计划、国家863计划等项目。曾获北京市科学技术二等奖，北京市科技进步二等奖，北京市普通高校教学成果二等奖。2009-2010在美国Auburn University做访问学者从事合作研究工作。

主要研究方向

多环境应力下高频、高速电接触故障机理研究与建模，互连多物理场耦合建模与仿真，微互连可靠性研究，射频连接器无源互调机理研究与建模，材料对无源互调的影响与建模，连接器寿命预测，以及电接触相关的电磁兼容问题研究等。

代表性成果

[1] L. Bi, J. Gao, G. T. Flowers, Z. Wang, J. Luo, W. Wang, Impact of Multiple Insertions and Withdrawals, and Vibration on Passive Intermodulation in Coaxial Connectors, IEEE Transactions on Microwave Theory and Techniques, vol.71, no.2, pp 488-499, 2023.

[2] K. Song, J. Gao, G. T. Flowers, Z. Wang, C. Wang, W. Yi, Z. Cheng, The Impact of the Connection Failure of Ground Solder Balls on Digital Signal Waveform, IEEE Transactions on Electromagnetic Compatibility, vol. 65, no.1, pp 312-322, 2023.

[3] Z. Wang, J. Gao, W. Wang, H. M. Bilal, Y. Wu, C. Wang, The Impact of Gold Plating Process for Bonding Pads on Interconnection Quality, IEEE Transactions on Device and Materials Reliability, vol. 22, no.1, pp 65-72, 2022.

[4] K. Song, J. Gao, G. T. Flowers, Z. Wang, W. Yi, Z. Cheng, Modeling and Analysis of Signal Integrity of Ball Grid Array Packages with Failed Ground Solder Balls, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.12, no. 2, pp 306-315, 2022.

[5] W. Wang, J. Gao, G. T. Flowers, Z. Wang, L. Bi, H. M. Bilal, Modeling of the Signal Transmission of a Coaxial Connector With a Degraded Dielectric Layer in a Humid Environment, IEEE Transactions on Dielectrics and Electrical Insulation, vol.29, no.4, pp 1522-1529, 2022.

[6] L. Bi, J. Gao, G. T. Flowers, G. Xie, Q. Jin, Modeling of Signal Distortion Caused by Passive Intermodulation and Cross Modulation in Coaxial Connectors, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.11, no.2, pp.284-293, 2021.

[7] Z. Wang, J. Gao, G. T. Flowers, W. Yi, Y. Wu, Z. Cheng, The Impact of Connection Failure of Bonding Wire on Signal Transmission in Radio Frequency Circuits, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.10, no.10, pp. 1729-1737, 2020

[8] Q. Jin, J. Gao, G. T. Flowers, Y. Wu, G. Xie and L. Bi, Modeling of Passive Intermodulation in Connectors With Coating Material and Iron Content in Base Brass, IEEE Transactions on Microwave Theory and Techniques, vol. 67, no. 4, pp. 1346-1356, 2019.

[9] Q. Li, J. Gao, G. T. Flowers, G. Xie, and R. L. Jackson, Effect of Electrical Contact Degradation on Analog Signal Transmission”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 12, pp. 2374-2382, 2019.

[10] Q. Jin, J. Gao, G. T. Flowers, Y. Wu, and G. Xie, Modeling of Passive Intermodulation With Electrical Contacts in Coaxial Connectors, IEEE Transactions on Microwave Theory and Techniques, vol. 66, no. 9, pp. 4007-4016, 2018.